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  • Rulebreakers Revolutions: MR-MUF Unlocks HBM Heat Control
    Molded underfill fills the gaps between stacked chips with protective material to increase durability and heat dissipation Combining the reflow and molding process, MR-MUF attaches semiconductor chips to circuits and fills the space between chips and the bump gap with a material called liquid epoxy molding compound (EMC)
  • MR-MUF Innovations Tackle Heat Generation - EE Times
    1 Mass reflow-molded underfill (MR-MUF): Mass reflow is a technology that connects chips together by melting the bumps between stacked chips Molded underfill fills the gaps between stacked chips with protective material to increase durability and heat dissipation
  • A Study on the Advanced Chip to Wafer Stack for Better Thermal . . .
    In this paper, mass reflow bonding with molded underfll process for chip to wafer stacking of HBM was studied MUF material and key process parameters were optimized, and 8Hi HBM was successfully demonstrated through MR-MUF method
  • SK hynix’s MR-MUF Innovations Tackle Heat Generation to Secure HBM . . .
    1 Mass reflow-molded underfill (MR-MUF): Mass reflow is a technology that connects chips together by melting the bumps between stacked chips Molded underfill fills the gaps between stacked chips with protective material to increase durability and heat dissipation
  • Fine Pitch Cu Pillar Assembly Challenges for Advanced Flip Chip Package
    Risk for package assembly with traditional mass reflow (MR) is much higher than ever before Thermal Compresssion Bonding (TCB) can potentially eliminate some of the risks for fine bump pitch However, lower throughput of TCB which impacts packaging cost is another big concern
  • Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu . . .
    Package Structure, Bumping and Assembly Process Flow Conventional FCBGA and chip scale fcCSP packages consist of a silicon chip, bumps (solder or Cu pillar), capillary or molded underfill encapsulant, a thermal lid, an organic laminated substrate (Figure 1) Figure 1 FCBGA and fcCSP Packages
  • HBM3E - SK Hynix
    SK hynix was the first to develop the MR-MUF (Mass Reflow-Molded Underfill) packing technology This technique, which simultaneously bonds the chips together via reflow while filling the gaps with liquid material is significant in development of the highly thermal-conducive HBM
  • Packaging Technology, a Key to Next-Generation Semiconductor . . .
    To achieve this, the PKG Development Division developed an exclusive, specialized technology called Mass Reflow Molded Underfill (MR-MUF) 8 for the first time in the world and applied it to HBM products Based on this technology, the thermal dissipation performance has been improved by more than 10℃ compared to competitors
  • 3D and 2. 5D Packaging Assembly with Highly Silica Filled One . . . - Kester
    These emerging materials chemically remove solder oxides and surface finishes to facilitate soldering during reflow while simultaneously curing to form a rigid reinforcing polymeric underfill that improve the reliability of the finished product
  • SK hynix Now Sampling 24GB HBM3 Stacks, Preparing for Mass . . . - AnandTech
    Meanwhile, the improved underflow material on their 12-Hi stacks is being provided via as part of the company's new Mass Reflow Molded Underfill (MR-MUF) packing technology This technique





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