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  • Architecting Waferscale Processors - A GPU Case Study
    Using a waferscale GPU as a case study, we show that while a 300 mm wafer can house about 100 GPU modules (GPM), only a much scaled down GPU architecture with about 40 GPMs can be built when physical con-cerns are considered We also study the performance and energy implications of waferscale architectures
  • Extension of the Equivalent Thickness Concept to the . . .
    Their use implicates a successful an effective monitoring and control of wafer warpage, as the geometrical size of the substrate increases, as well as a command control on the degeneration of non-linear warpage into critical phenomena known as bifurcation or buckling
  • (PDF) A Comparative Study of Analytical and Finite Element . . .
    In the investigation we developed both an analytical approach and a finite element analysis (FEA) with ANSYSY® software to model the equivalent thickness of a 4H-SiC taiko wafer
  • Scaling equations for the accurate prediction of CMOS device . . .
    This paper presents a method for quickly and accurately determining a scaling factor of CMOS device performance between different technology nodes, characterized both by different transistor sizes and different device types, without needing to model the entire design using different Spice libraries
  • Assessing the true cost of node transitions - Tech Design Forum
    Figure 2: Increasing wafer size reduces the manufacturing cost per chip (Click image to enlarge) Lastly, as for any new manufacturing process, the costs will come down over its lifetime They may still be more than for the previous node, but not nearly as high as at the process’ launch
  • Chapter 2 Basic principles in FEA (Finite Element Analysis)
    The equivalent nodal loads are defined by the condition for equivalence of the work, done by the nodal loads on the possible nodal displacements and the work of the actual loads on the virtual displacements of the points





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